Plutos computers doo

NVIDIA RTX PRO 5000 "Blackwell" GPU with 72 GB GDDR7 Memory Appears

21-10-2025 07:00

NVIDIA's RTX PRO 5000 "Blackwell" GPU has officially appeared with 72 GB of GDDR7 ECC memory, on the company's product page. Initially, NVIDIA launched an RTX PRO 5000 Blackwell GPU with 48 GB of GDDR7 memory spread across 24 modules with the capacity of 2 GB, sandwiching the PCB on both sides. However, NVIDIA has now decided to update the GPU with the new 3 GB memory modules, which are upping the total capacity to 72 GB, making the card a much more attractive offer for professionals working in the fields of data science, AI, HPC, and many other areas such as professional video editing. However, this 24 module design with 12 GDDR7 modules on each side is less impressive than the RTX PRO 6000 Blackwell GPU, which is arranging 16 such modules on each side of the PCB to achieve a remarkable 96 GB capacity. As a reminder, the RTX PRO 5000 GPU is based on the GB202 GPU and carries 14,080 CUDA cores, 440 TMUs, and 176 ROPs. Upgraded NVENC/NVDEC blocks speed up high-quality encode/decode for live production and fast video editing. Multi-Instance GPU (MIG) gives IT and cloud/VDI admins an easy way to split a GPU into isolated instances, so more users get guaranteed, accelerated performance. NVIDIA has wrapped all of this in a 300 W TDP in a dual-slot GPU, with a blower fan. Pricing structure is still unknown, but given that its older sibling, the RTX PRO 6000 Blackwell, is retailing just under $10,000, we could see the 72 GB version just a grand or two lower. Additionally, as we see NVIDIA incorporating 3 GB GDDR7 memory modules inside more products, the company could be gearing up for a "SUPER" overhaul of the Blackwell gaming lineup.

Cooler Master Intros Hyper 212 3DHP CPU Cooler

21-10-2025 02:30

Cooler Master today introduced the Hyper 212 3DHP, its first CPU air cooler to implement its proprietary 3D Heatpipe technology that the company showcased at the 2025 Computex in May. The cooler introduces a unique new heatpipe design. While most aluminium fin-stack tower-type coolers have their heatpipes designed such that they are bent in a U-shape, with their middle regions being part of the cooler's base that makes contact with the heat source, Cooler Master's 3D Heatpipe design involves a branch of the heatpipe right in the middle of the heatpipe that projects upward, through the middle region of the fin-stack. This design more uniformly spreads heat across the fin-stack, as heat from each heatpipe is spread both across the central and peripheral regions of each fin. There are two variants of the Cooler Master Hyper 212 3DHP, the main variant with ARGB LED-illuminated fan, and the Hyper 212 3DHP Black, which comes with a black, non-illuminated fan. Besides lighting, both variants offer identical specs. The cooler measures 133 mm x 86 mm x 158 mm (WxDxH), the company didn't disclose weight. The cooler comes with two 3D heatpipes, which branch out to a total of six ends. The heatpipes make contact with the CPU over a copper base. The included 120 mm fan turns at speeds of up to 2,050 RPM, pushing up to 63.1 CFM of airflow at 2.69 mm H₂O of static pressure, and a maximum noise output of 27 dBA. Unlike other coolers from Cooler Master in this category which come with 2-year warranties, the company is backing this cooler with a generous 5-year warranty as added confidence in the build quality of its 3D heatpipes. The company is pricing the Hyper 212 3DHP Black at $29.99, which is the same price as the current Hyper 212 Black.

(PR) Cooler Master Ships V4 Alpha 3DHP Black CPU Cooler

21-10-2025 02:30

Cooler Master, a global leader in PC components and tech lifestyle solutions, today announced worldwide availability of the V4 Alpha 3DHP Black CPU air cooler. As the newest standalone product under the company's Thermal Excellence campaign, V4 Alpha couples Cooler Master's patented 3DHP technology with a minimalist, single-tower form factor that fits effortlessly into mainstream and high-end builds. "With the V4 Alpha 3DHP, we condensed our V-engine concept into a design that runs cooler, quieter, and cleaner than anything else in its class," said Matteo Stracciari, GM of Cooler Master. "It's proof that Thermal Excellence can fit any build—no compromises required." Read full story

Zotac Boards Powerful Mini PC Hype Train With NVIDIA RTX 5060 Ti-Powered ZBOX MAGNUS

21-10-2025 02:30

In light of the recent flood of AI-ready mini PCs coming from the likes of Framework and GMKtec, Zotac has announced its own competitor, this time opting for a slightly different approach than the hyped AMD Ryzen AI Max+ 395 APU. Instead, the component company known for its mini PCs and discrete NVIDIA GPUs has equipped the Zbox Magnus (stylized as ZBOX MAGNUS) with an NVIDIA GeForce RTX 5070 Ti and up to a 20-core (8 performance, 12 efficiency cores) Intel Core Ultra 7 255HX CPU paired with dual memory slots for up to 96 GB of DDR5-6400 CSODIMM or DDR5-5600 SODIMM RAM—all in a mere 2.65-liter chassis. By default, however, the Magnus doesn't ship with RAM or storage, with a barebones variant currently listed on the company's Chinese site at a converted price of around $1,966 (13,9999 Yuan). The product page lists the cooling solution as a heatsink and fan, but it's unclear whether there are separate heatsinks and fans for the CPU and GPU, raising questions about potential thermal throttling, given the tiny chassis. Zotac says that the Zbox Magnus is the first mini PC of its size to offer a desktop-class GeForce RTX 5060 Ti 16 GB GPU in a chassis that small, with the chassis measuring in at just 210 × 203 × 62.2 mm. That small chassis comes with the caveats that the Zbox Magnus needs a 330 W external AC-DC adapter, and that it features a soldered laptop-class CPU. Despite the small chassis, the Zbox Magnus has a decent selection of ports, with five USB Type-A ports, dual front USB Type-C ports, and dual Ethernet ports. It also comes with wall mount hardware and Wi-Fi antennae in the box. Read full story

Motion Twin Addresses Dead Cells 2 Demand: "We Are Driven by What We Want To Make"

20-10-2025 23:38

Dead Cells has been one of the most talked-about indie games in the seven years since its launch, with fans clamoring for a sequel that seems to never be coming—despite plenty of other content having recently been added to the game. In a recent interview with PCGamesN, Motion Twin, the developer behind the smash-hit roguelite, has addressed the demand for a sequel to Dead Cells. The co-creative director and game designer at Motion Twin, Yannick Berthier, explained that Motion Twin is "a collective of individuals that are creative and want to create stuff," and that the company's unorthodox structure allows it to follow creativity instead of pursuing profits. Berthier went on to say that part of the reason Motion Twin made Windblown instead of Dead Cells 2 is that the team wanted to create something in "a new universe, super bright, that could be co-op." He also supposed that the company's indie nature allows it to continue exploring things that the creative team want instead of appealing to shareholders or the internal pressures of a parent company. Windblown launched nearly a year ago, on October 24, and although it's still in Early Access on Steam, it's still notable that it has not yet surpassed Dead Cells when it comes to player counts, at least according to SteamDB. Despite this and the continued pressure from fans for the sequel to the beloved roguelite, Berthier says that Motion Twin doesn't regret pursuing Windblown instead of Dead Cells 2, going on to say that the eight-person, employee-owned studio "followed its heart." Windblown has changed greatly since its launch, with frequent updates mostly based on player feedback, but it still seems to be fighting a bit of an uphill battle to be able to compete with its predecessor. Currently, Windblown is only available in Early Access on Steam, and a full 1.0 launch date has not yet been announced.

(PR) JEDEC Nears Completion of JESD328 SOCAMM2 Standard for LPDDR5X Memory Modules

20-10-2025 23:29

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced it is nearing completion of JESD328: LPDDR5/5X Small Outline Compression Attached Memory Module (SOCAMM2) Common Standard, an upcoming standard for low-profile LPDRAM modules developed specifically for data center AI applications. When published, JESD328 is designed to provide a memory platform that delivers modular, low-power, high-bandwidth memory for AI CPU servers and accelerated computing platforms. JESD328 will define a compact, serviceable LPDDR5X-based module, Small Outline CAMM2 (SOCAMM2). JESD328 SOCAMM2 is set to introduce an optimized, compact form factor for servers with a mechanical outline designed for high-density data center chassis and board layouts, with scalability to provide a path to support the large module capacities required by AI training and inference servers. Read full story

AWS Outage Takes Half of the Internet Down, Services Now Recovering

20-10-2025 21:45

Amazon Web Services (AWS) outage has just taken down half of the known internet. However, services are now recovering. Just as Monday started on the Pacific Daylight Time (PDT), AWS reported incidents of multiple AWS services being down, with a simple confirmation that "We are investigating increased error rates and latencies for multiple AWS services in the US-EAST-1 Region." Online services like Amazon.com, Alexa, ChatGPT, Epic Games Store, Epic Online Services, social media like Snapchat, and games like Fortnite, have been down since. A few hours later, AWS confirmed that it had isolated the issue. "We have identified a potential root cause for error rates affecting the DynamoDB APIs in the US-EAST-1 Region," they stated, adding, "This issue also impacts other AWS services in the US-EAST-1 Region. Global services or features that rely on US-EAST-1 endpoints, such as IAM updates and DynamoDB Global tables, may also be experiencing issues. During this time, customers may be unable to create or update Support Cases. We recommend customers continue to retry any failed requests." Subsequently, AWS confirmed that the "underlying DNS issue has been fully mitigated, and most AWS service operations are now succeeding normally." Update 19:45 UTC: AWS is still experiencing some outage, but full recovery is in progress. The team stated "We continue to observe recovery across all AWS services, and instance launches are succeeding across multiple Availability Zones in the US-EAST-1 Regions." Read full story

(PR) Second Sun is Launching on PC on the 5th of November

20-10-2025 21:17

Iceberg Interactive and Grey Wolf Entertainment are proud to announce the release date of Second Sun, a beautiful, fast-paced FPS that masterfully blends several genres into one. Second Sun is set to release on the 5th of November 2025 on PC (Steam) with a 15% launch discount. Inspired by old-school shooters and ARPGs, Second Sun is a loot-and-shoot game that blends open-world elements with RPG-style progression and storytelling. Though it has fixed landmarks, the game offers a fresh experience at every new start by procedurally generating new dungeons. The movement-based action is the key to making all of these elements work in symbiosis. Read full story

(PR) Google Cloud G4 VMs With NVIDIA RTX PRO 6000 Blackwell GPU Now Generally Available

20-10-2025 20:15

NVIDIA and Google Cloud are expanding access to accelerated computing to transform the full spectrum of enterprise workloads, from visual computing to agentic and physical AI. Google Cloud today announced the general availability of G4 VMs, powered by NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs. Plus, NVIDIA Omniverse and NVIDIA Isaac Sim are now available as virtual machine images (VMIs) on the Google Cloud Marketplace to unlock physical AI-driven applications for key industries like manufacturing, automotive and logistics. This powerful combination creates a versatile, multi-workload platform for enterprises to accelerate their most demanding challenges on Google Cloud. NVIDIA RTX PRO 6000 Blackwell GPUs excel at high-performance AI inference for multimodal, generative and agentic AI deployments, while also powering complex visual and simulation workloads ranging from computer-aided engineering and content creation to robotics simulation. Customers like WPP are using G4 VMs with NVIDIA Omniverse to instantly generate photorealistic 3D advertising environments at global scale, while Altair is using the platform within Altair One to accelerate demanding simulation and fluid dynamics workloads. Read full story

(PR) In Win Launches SHIFT Premium Open Frame Chassis

20-10-2025 17:53

In Win Development Inc. proudly announces the launch of its latest open-frame PC chassis: SHIFT. Engineered as a canvas for creative expression, SHIFT reimagines the possibilities of PC case design by fusing artistry, versatility, and precision engineering into a bold, futuristic platform. It seamlessly transitions between testbench, gaming rig, and hardware showcase, offering flexible hardware configurations and adaptable orientations that empower users to build a setup that truly reflects their individuality. SHIFT embodies the spirit of InWin's iBuildiShare initiative, which encourages DIY enthusiasts to embrace the joy of building, crafting, and sharing; transforming PC assembly into a more interactive and meaningful experience. Read full story

(PR) XPPen Unveils New Artist 12 3rd with X-Dial Shortcut Keys

20-10-2025 17:24

XPPen today unveiled the groundbreaking Artist 12 3rd, a new dial shortcut portable display featuring the state-of-the-art X4 smart chip stylus. This compact device incorporates major feature upgrades that set the trend for portable creation. Representing one of the most significant updates in the drawing display category, the Artist 12 3rd combines the revolutionary X-Dial shortcut keys, 16K pressure levels, and a paper-like display—delivering an unprecedented creative experience that redefines efficiency, control, and portability for artists worldwide. "At XPPen, we remain committed to enhancing the user experience through technological innovation," said Amy Yuan, Brand Director at XPPen. "For the latest Artist 12 3rd, we have reimagined the user interface with our innovative industrial design language—the X-Dial shortcut keys—to provide creators with a more intuitive and efficient workflow. Technically, the upgraded X4 smart chip in the stylus delivers significantly more processing power that translates to a faster response rate, heightened sensitivity, and exceptional precision. Our aim is to bridge the gap for entry-level creators and those who value portability by offering a device that doesn't compromise on professional performance." Read full story

(PR) Compute-In-Memory APU Achieves GPU-Class AI Performance at a Fraction of the Energy Cost

20-10-2025 17:04

GSI Technology, Inc. (Nasdaq: GSIT), the inventor of the Associative Processing Unit (APU), a paradigm shift in artificial intelligence (AI) and high-performance compute (HPC) processing providing true compute-in-memory technology, announced the publication of a paper led by researchers at Cornell University. Findings confirmed that GSI Technology's APU CIM (Compute-In-Memory) architectures can match GPU-level performance for large-scale AI applications with a dramatic reduction in energy consumption due to high-density and high-bandwidth memory associated with the CIM architecture. Key findings include:GPU-class performance - The Gemini-I APU delivered comparable throughput to NVIDIA's A6000 GPU on RAG workloads.Massive energy advantage - The APU delivers over 98% lower energy consumption than a GPU over various large corpora datasets, underscoring its efficiency and sustainability.Faster and more efficient than CPUs - The APU's unique design allows it to perform retrieval tasks several times faster than standard CPUs, shortening total processing time by up to 80%. Read full story

(PR) Supply Chain and Application Breakthroughs to Drive OLEDoS Penetration in VR/MR to 58% by 2030

20-10-2025 13:05

Apple is making a notable comeback in the VR/MR market with its upgraded Vision Pro, which still uses OLEDoS display panels. The device aims to drive the next generation of head-mounted devices by enhancing computing power and weight distribution. TrendForce's latest report on "2025 Near-Eye Display Market Trends and Technology Analysis" indicates that OLEDoS, the preferred display technology for mid-to-high-end VR/MR devices, is experiencing significant breakthroughs in both supply chain and application areas. Consequently, OLEDoS adoption in VR/MR is projected to rise to 58% by 2030. Read full story

NVIDIA "Vera Rubin" NVL144 Servers Set for 2026 Volume Production

20-10-2025 12:46

Foxconn has begun engineering validation for NVIDIA's "Vera Rubin" NVL144 MGX liquid-cooled racks, with plans for mass production in the latter half of 2026, according to internal supply-chain documents obtained by Taiwan Economics Daily. Each NVL144 unit features 144 Rubin GPUs with HBM4, updated 88-core Vera CPUs, and ConnectX-9 NICs and NVLink 6 interconnect for CPU-to-GPU and GPU-to-GPU communication, effectively doubling the compute density of the current NVL72 platform. The Taiwanese contractor Foxconn currently handles about 60% of NVIDIA's AI server output and is expanding its immersion-cooling and copper-plating lines at its Wisconsin and Houston facilities to meet new domestic manufacturing requirements. The gap between GB300 peak shipments and Rubin's first silicon will be six to eight months, the shortest generational gap in NVIDIA's history. Despite the accelerated roadmap, Blackwell Ultra remains NVIDIA's main revenue source through mid-2026. Procurement data shows that cloud providers have reserved around 400,000 GB300 nodes for delivery in late 2025 and early 2026, indicating strong near-term demand. At the same time, OpenAI has placed a large preorder for Vera Rubin silicon, securing initial production volumes and supporting Foxconn's capacity investments. The rapid transition from Hopper to Blackwell and then to Rubin within 30 months marks the fastest acceleration of datacenter equipment cycles, leading hyperscale operators to speed up depreciation schedules.

Longsys Announces Industry's First Integrated-Packaging mSSD

20-10-2025 11:40

Longsys has announced the industry's first integrated-packaging micro SSD (mSSD), featuring a fully chip-level design that eliminates the traditional PCB assembly process. The new mSSD uses wafer-level System-in-Package (SiP) technology to integrate the controller, NAND, power management integrated circuit (PMIC) and passive components into a single package removing nearly 1,000 solder joints found in standard PCB-based SSDs. According to Longsys, this approach boosts reliability, reducing defect rates from ≤1000 DPPM to ≤100 DPPM and improves production efficiency by removing multiple surface-mount (SMT) and reflow steps. Moreover, this helps streamline manufacturing and lowers additional costs by more than 10%, while cutting energy use and carbon emissions. Despite its compact 20 × 30 × 2.0 mm size and 2.2 g weight, the mSSD delivers full PCIe Gen 4 ×4 performance with sequential read speeds up to 7400 MB/s, writes up to 6500 MB/s, and up to 1000K / 820K IOPS in 4K random workloads. The device is equipped with an aluminium frame, graphene thermal pad and thermal silicone for heat dissipation. The mSSD supports TLC and QLC NAND configurations with capacities from 512 GB up to 4 TB, and includes a modular clip-on heatsink that allows conversion between M.2 2230, 2242, and 2280 form factors. Longsys says the product is now ramping into mass production and has applied for related international patents. Read full story

(PR) Axiomtek Intros IMB701 ATX Server Motherboard Powered by Intel Xeon CPUs

20-10-2025 09:36

Axiomtek, a world-renowned leader relentlessly devoted to the research, development, and manufacture of innovative, highly efficient, and reliable industrial computer products, proudly announces the launch of its IMB701, a high-performance server-grade ATX motherboard designed to meet the demands of AI, high-performance computing, and advanced image analysis. Powered by the latest 5th/4th Gen Intel Xeon Scalable Processors (up to 350 W TDP), the IMB701 delivers unparalleled computing performance with enterprise-level reliability. High-Performance Architecture The IMB701 supports the Intel Xeon Scalable platform with an LGA4677 socket, handling processors with up to 350 W TDP. It offers eight DDR5-5200 R-DIMM ECC slots, enabling up to 512 GB of high-density memory for demanding workloads. Its advanced architecture includes five PCIe x16 Gen 5 slots, enabling the integration of multiple GPUs and acceleration cards, making it highly scalable for AI workloads and video analytics, AOI, and LLM applications. Read full story

Windows 11 25H2 October Update Bug Renders Recovery Environment Unusable

19-10-2025 15:12

It seems like Microsoft has encountered a significant issue with the latest Windows 11 25H2 October update, KB5066835. The company confirmed that this update disrupts mouse and keyboard functionality within the Windows Recovery Environment (WinRE), making them unresponsive and unusable. As a result, the WinRE feature is completely inoperative. WinRE is a built-in troubleshooting toolkit included with Windows. It's intended to assist users when their computer encounters startup problems or system issues. WinRE activates automatically when Windows crashes or fails to boot properly, but users can also access it manually to utilize various repair tools. However, with the current problem affecting keyboard and mouse input, WinRE is essentially ineffective. Microsoft stated that "the USB keyboard and mouse continue to work normally within the Windows operating system," and assured users that they are "working to release a solution to resolve this issue in the coming days. More information will be provided when it is available." This is yet another incident related to the recent Windows 11 updates, which have previously caused localhost issues. The list of Windows 11 problems continues to grow as the latest updates are released. Microsoft maintains a Windows 11 version 25H2 known issues and notifications website that provides status updates on the latest problems, including this one. Read full story

This Week in Gaming (Week 43)

19-10-2025 12:01

Welcome to the second to last week of October, a week which bloodies its fangs with a major release involving pale skin tones in dark corners of Seattle. The week continues with a fantasy RTS which is followed by ninjas that aren't wearing pyjamas, a different take on super heroes, some old school arcade action but with modern graphics and finally landing in a big sticky mess of a ball. There are a lot more new releases this week as well, just in case none of the other games suits your blood type. Vampire: The Masquerade - Bloodlines 2 / This week's major release / Tuesday 21 October You are the Nomad—an elder vampire awakening from a century-long slumber, new to the modern nights. Trapped in your Blood is a stranger's voice. This entity, a vampire detective known as Fabien, will be your guide to 21st-century Seattle. You will explore the city through his eyes as well as those of the Nomad, as you revisit a cold case from a hundred years ago that is threatening undead and mortal society alike. Steam link Read full story

(PR) NVIDIA and TSMC Celebrate First NVIDIA Blackwell Wafer Produced in the US

18-10-2025 20:02

AI has ignited a new industrial revolution. NVIDIA and TSMC are working together to build the infrastructure that powers the world's AI factories, right here in America. NVIDIA founder and CEO Jensen Huang today visited TSMC's semiconductor manufacturing facility in Phoenix to celebrate the first NVIDIA Blackwell wafer produced on U.S. soil, representing that Blackwell has reached volume production. Onstage at the celebration, Huang joined Y.L. Wang, vice president of operations at TSMC, to sign the Blackwell wafer, commemorating a milestone that showcases how the engines of the world's AI infrastructure are now being constructed domestically. This bolsters the U.S. supply chain and onshores the AI technology stack that will turn data into intelligence and secure America's leadership for the AI era. "This is a historic moment for several reasons. It's the very first time in recent American history that the single most important chip is being manufactured here in the United States by the most advanced fab, by TSMC, here in the United States," Huang said at the event. "This is the vision of President Trump of reindustrialization - to bring back manufacturing to America, to create jobs, of course, but also, this is the single most vital manufacturing industry and the most important technology industry in the world." Read full story

Intel Foundry Reportedly Secures 18A Order from Microsoft for Maia 3 Accelerator

18-10-2025 19:26

Intel has secured a significant order from Microsoft, putting trust from external customers into Intel Foundry. According to Charlie Demerjian from SemiAccurate—and shared by X user @Jukanlosreve—Microsoft will manufacture its Maia 3 chip codenamed "Griffin" at Intel Foundry using the 18A or 18A-P process. This 18A-P node improves upon Intel's 18A by incorporating the RibbonFET and PowerVia technologies, offering enhanced performance and energy efficiency. Compare to the regular 18A node, improvements include newly designed low-threshold voltage components, optimized elements to reduce leakage, and refined ribbon width specifications, all aimed at boosting performance-per-watt metrics. This is particularly important for AI accelerators used in data centers, which require high efficiency due to the large number of units involved. Microsoft could relocate the production of future Maia accelerators, following Maia 3, to Intel Foundry. If the Maia 3 project is successful, they plan to continue with Intel's more advanced nodes. As a reminder, Microsoft's first-generation Maia 100 chips were produced using TSMC's N5 process with CoWoS-S interposer technology. These chips feature an 820 mm² die size and operate at a 500 W TDP, with a maximum design power of 700 W. They include 64 GB of HBM2E memory providing 1.8 TB/s bandwidth and 500 MB of L1/L2 cache. The chips achieve peak tensor performance of 3 PetaOPS at 6-bit precision, 1.5 PetaOPS at 9-bit, and 0.8 PetaFLOPS for BF16. Connectivity options include 600 GB/s backend network bandwidth via twelve 400GbE ports and 32 GB/s host bandwidth through PCIe Gen 5 x8. Update October 18, 17:30 UTC: Charlie Demerjian confirmed that the name of the chip is actually a third generation Maia 3 accelerator codenamed "Griffin."Read full story