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IT Vesti
AMD "Zen 6" Processor Families to Use a Mix of TSMC N2 and N3 Nodes
14-07-2025 16:56
AMD's upcoming Zen 6 CPU family will leverage a combination of TSMC's N3 and N2 process nodes, according to slide decks shared with engineers at three leading motherboard vendors. These documents outline five distinct silicon lines set to arrive in late 2026 across servers, desktops, and notebooks. On the server front, the EPYC "Venice" lineup splits into Venice classic for general‑purpose deployments and Venice dense for high‑density cloud racks. Both variants use TSMC's custom‑tuned N2P process, offering an 8-10% clock‑speed boost over today's N3E. At the same time, each classic die grows to 12 Zen 6 cores, and each dense die houses 32 Zen 6c cores, enabling up to 256‑core, 512-threaded dense packages when eight dies are interconnected via the existing organic interposer. For client systems, AMD has adopted codenames that hint at their intended usage profiles. "Olympic Ridge" will drive the Ryzen 10000 desktop series on the N2P node, while "Gator Range" targets gaming laptops exceeding 55 W. The mainstream thin‑and‑light segment will be served by "Medusa Point," featuring a hybrid design that pairs an N2P compute tile with an N3P I/O tile, with entry‑level models opting for a cost‑efficient monolithic N3P die. A more detailed "Medusa Halo" and the budget‑oriented "Bumblebee" series are also in the roadmap, though their process assignments remain under review. AMD and TSMC's close co‑optimization of metal layers and libraries means the final silicon closely resembles an "N2‑AMD" stack rather than a standard N2P node. First silicon is expected back from the fab before Christmas, with volume ramps timed for the back‑to‑school 2026 notebook cycle and a subsequent server refresh wave. (PR) JNTC Unveils Next-Generation Glass Substrate for Semiconductors
14-07-2025 16:28
JNTC Co., Ltd., a leading advanced materials company, hosted a product launch on June 30 at the Korea Exchange Conference Hall, unveiling its new Through-Glass-Via (TGV) glass substrate under the theme Carving Semiconductors into Glass, the Dream Material.' The event drew more than 200 attendees, including journalists and investors. CEO Andrew Cho introduced the proprietary TGV glass substrate as a breakthrough solution to the limitations of plastic-based substrates. Designed for AI and high-performance computing applications, the substrate offers excellent flatness and thermal stability, which help reduce warpage and heat generation under high-speed processing. JNTC completed its domestic production line in June and expects to begin full-scale manufacturing in August, following test runs in July. Unlike competitors, JNTC built and engineered most of its core production equipment in-house, enabling cost efficiency and full process independence. This approach cut initial investment costs to about one-fifth of the industry average. Read full story Kingston Unveils IronKey D500S Flash Drive with NIST FIPS 140-3 Level 3 Validation
14-07-2025 15:32
Kingston today unveiled the IronKey D500S hardware-encrypted USB flash drive, which meets FIPS 140-3 Level 3 security validation. The drive offers on-device hardware encryption meeting XTS-AES 256-bit. The drive also offers an industry-first dual hidden partition option; and a crypto-erase password option (a decryption password that causes the drive to destroy its data). The drive comes in various capacities, ranging from 16 GB to 512 GB. It comes in a rugged zinc alloy casing. It meets IP67 waterproof and dustproof ratings. The drive comes with a 5 Gbps USB 3.2 Gen 1 type-A interface. The 16 GB to 128 GB variants offer sequential speeds of up to 260 MB/s reads with up to 190 MB/s writes; the 256 GB variant offers up to 240 MB/s reads with up to 170 MB/s writes; and the top 512 GB model reads at up to 310 MB/s with up to 250 MB/s writes. When plugged into USB 2.0, all models cap out at up to 30 MB/s reads with up to 20 MB/s writes. Ugreen Sneaks Out the DH4300 Plus Arm Based NAS
14-07-2025 15:23
Although we did notice a picture of the new model as part of an ad on Ugreen's website last week, there was no product page then, but it was added at some point towards the end of last week. The new model is known as the NASync DH4300 Plus and it's based around a Rockchip RK3588C SoC. The RK3588C sports four Arm Cortex-A76 cores that clock up to 2.4 GHz and four Cortex-A55 cores, which is far from cutting edge today, but should hopefully be powerful enough for a consumer NAS. Ugreen has paired the CPU with 8 GB of LPDDR4X and 32 GB of eMMC for the OS. The DH4300 Plus is a 4-bay NAS with support for up to four 30 TB SATA drives, but there are no M.2 NVMe slots, even though the Rockchip SoC could in theory have supported a single drive. Other features include a 2.5 Gbps Ethernet port, one USB Type-C and two USB Type-A, all USB 3.2 Gen 1 (5 Gbps) and an HDMI port capable of 4K60p output. The latter makes sense if Ugreen has carried over the media playback features from its range of x64 based NASes. The drive caddies are loaded from the top, which gives the DH4300 Plus a rather different design from your average NAS. According to NAS Compares, Ugreen is also set to release a cheaper, 2-bay version called the DH3200, which is based around the same hardware. The NASync DH4300 Plus has an MSRP of US$430/€430, but is currently available for US$344/€344 directly from Ugreen, with an expected shipping date of the 25th of July. (PR) Transcend Intros the ESD420 Magnetic Portable SSD Series
14-07-2025 11:56
Transcend Information, Inc. (Transcend), a global leader in embedded and consumer storage solutions, proudly announces the launch of its new magnetic portable SSD—the ESD420. Designed with user convenience in mind, the ESD420 features a MagSafe-compatible magnetic design that allows it to securely attach to iPhones or any magnetic accessories and devices. Weighing only 48 grams, it offers blazing-fast 20 Gbps transfer speeds and supports 4K ProRes video recording directly from iPhones. With up to 4 TB of storage capacity, this ultraportable SSD is the perfect companion for outdoor photographers, video editors, and content creators. Magnetic Design for Intuitive, On-the-Go Use The ESD420's magnetic design ensures a secure attachment to MagSafe-compatible iPhones or other magnetic surfaces. Whether you're shooting on location, traveling, or attending meetings, the ESD420 allows for seamless storage expansion and instant backup, delivering an intuitive and convenient mobile storage experience. Read full story Deal Alert: Get Windows 11 Pro for Just $9.97 Before Windows 10 Support Ends
14-07-2025 11:50
Windows 10 is on its way out, and the price of upgrading just hit an all-time low. Right now, a lifetime license for Windows 11 Pro is only $9.97 (MSRP $199.99). That's a 95% drop, but the deal ends July 15 at 11:59 p.m. PT. Whether you're upgrading an old laptop or building your next rig, now's the time to make the leap, especially since Windows 10 support officially ends in October 2025. That means no more security updates, patches, or features. Windows 11 Pro isn't just an upgrade—it's your route to staying secure, productive, and game ready. Buy Windows 11 Pro at $9.97 from Stackcommerce Read full story (PR) Silicon Power Launches WP10 Magnetic Wireless Power Bank
14-07-2025 11:44
Silicon Power (SP) has launched its latest portable charging solution, the WP10 magnetic wireless power bank. With a 10,000mAh capacity, up to 15 W of wireless charging, and 20 W USB-C Power Delivery (PD) support, the WP10 is designed to provide powerful, convenient, and versatile charging for mobile users. Featuring magnetic snap-on charging for iPhone 12 and later, a foldable kickstand, and simultaneous charging of up to three devices, this sleek and functional power bank is the perfect companion for life in motion. Magnetic Convenience Meets Fast-Charging Performance The WP10 stands out with its strong 10N magnetic attachment, ensuring a secure, snap-on wireless charging experience for MagSafe-compatible iPhones. Delivering up to 15 W wireless power, it eliminates cable clutter while keeping devices firmly in place during use. The USB-C port supports 20 W PD output and 18 W input, while the USB-A port delivers 18 W QC fast charging, enabling users to quickly top up multiple devices on-the-go. For even more flexibility, the WP10 allows users to charge three devices simultaneously via USB-C, USB-A, and wireless charging. Read full story ASUS Unveils ROG Astral GeForce RTX 5090 Real Gold Edition with 5 kg of Pure Gold
14-07-2025 11:27
At Bilibili World 2025, ASUS introduced one-of-a-kind ROG Astral GeForce RTX 5090 Real Gold Edition, a GPU with literal real-world gold. Weighing in at 7.24 kg the card incorporates 5 kg of 24‑karat gold across its frame, backplate, and outer shell, giving its raw materials alone a value exceeding half a million US Dollars. ASUS China general manager Tony Yu, known online as "Uncle Tony," revealed the piece alongside content‑creator partner "Talented Cai Qian." According to ITHome, the sand‑mold casting process produced an uneven, almost molten texture on the calligraphy and cooling fins, clearly distinguishing this one‑off prototype from any mass‑produced design. This solid‑gold edition follows the earlier Dhahab OC line, which featured only a thin layer of precious metal, and it now stands as a monument to luxury. At current bullion prices, the value of the gold alone surpasses that of a fully loaded AI server. ASUS has not confirmed the card's next destination, though it may be auctioned like previous limited editions signed by NVIDIA CEO Jensen Huang, with proceeds benefiting children's hospitals. With gamers usually focusing on performance per watt, they will look elsewhere, as this is certainly not a value buy. The underlying RTX 5090D silicon remains unchanged, and the gilded cooler is too large for most standard chassis, meaning that only collectors will prize the GPU for its one-of-a-kind build. LG Electronics to Enter Semiconductor Equipment Market with Hybrid Bonding
14-07-2025 09:36
LG Electronics has quietly launched a plan to become a semiconductor equipment maker. Its Production Technology Research Institute has begun developing a hybrid bonding machine tailored for next-generation high bandwidth memory (HBM), with an internal goal of shipping production units by 2028. Hybrid bonding is a wafer-level joining technique that eliminates the need for solder bumps. Instead, copper pads on each die are planarized to nanometer-scale smoothness and pressed together at room temperature, forming a permanent direct electrical contact. This method yields thinner memory stacks, operates at lower temperatures, and delivers faster electrical performance than those assembled with conventional thermal compression bonding. HBM consists of tightly stacked DRAM layers, where current packaging supports up to eight layers with thermal compression bonding. Stacking beyond twelve layers causes the solder bump pitch to collapse, making hybrid bonding essential for taller, more efficient stacks. LG's push into hybrid bonding development comes as industry leaders SK hynix, Micron, and Samsung race to supply HBM4 and HBM4E memory for NVIDIA, AMD, Intel, Google, and Amazon's AI systems slated for 2026. To accelerate its program, LG is recruiting dozens of PhDs in semiconductor packaging and collaborating with Seoul National University. The company views the hybrid bonding as a natural extension of its existing B2B offerings in HVAC and robotics. Currently, only the Dutch firm BESI and the US supplier Applied Materials offer commercial hybrid bonding, and neither has operations in Korea. Local competitors, including Samsung's Semes, Hanwha Semitec, and Hanmi Semiconductor, remain in prototype or pilot phases. If LG meets its 2028 target, its first customer shipments could align with SK Hynix's HBM4E volume ramp and Samsung's HBM4 risk line launch. Intel's Core Ultra 5 245HX Laptop CPU Outruns Its Desktop Twin
14-07-2025 09:05
An early PassMark entry posted on X by the account "X86 is dead&back" offers a glimpse of Intel's Core Ultra 5 245HX notebook processor. The 14-core "Arrow Lake-H" mobile chip quietly outpaced its desktop counterpart, the Core Ultra 5 245, in both single-core and multi-core tests. The numbers themselves are straightforward. The 245HX recorded 4,706 points in single-core and 41,045 points in multi-core runs. By comparison, the desktop Core Ultra 5 245 logged 4,409 and 37,930, respectively, handing the notebook silicon a 7% lead in single-core results and an 8% advantage when all cores are engaged. Against the Core i5-14500, the 245HX is 19% faster in single-core work and 30% faster in heavily threaded tasks. The gap widens further versus last year's mobile i5-14500HX, where the newcomer enjoys a 30% single-core margin and a 41% multi-core edge. The explanation is partly thermal. Intel grants the 245HX a maximum turbo power envelope of 160 W, well above the 121 W ceiling of the desktop 245. Clock speeds peak at 5.1 GHz, and the core configuration remains identical, pairing six performance cores with eight efficient cores. The higher TDP gives the HX version a chance to run at higher clocks for longer. Notebook manufacturers are expected to reveal Arrow Lake-HX systems later this quarter. Real-world gaming is a different arena, and PassMark is only one ruler. Yet the signs are hard to ignore: a mid-range laptop processor now outworks desktop counterparts. This Week in Gaming (Week 29)
13-07-2025 12:03
Welcome to the middle of July and this week we have a lot of Japanese games for you. We kick off with this week's major release which is based on an anime series, like several other games this week, although this one is a bit more pink. This is followed by a space colony sim, a JPRG based on a manga/anime series, a Japanese fighting game, a cop that is partially robot and we round things off with what is said to be an alternative take on Pac-Man. Madoka Magica Magia Exedra / This week's major release / Wednesday 16 July Characters from the hit anime series "Puella Magi Madoka Magica" come together! Featuring an all-new story setting and characters from the original ideas of Gekidan Inu Curry (Doroinu), experience the action alongside Magical Girl memories in this battle RPG. Steam link Read full story Borderlands 4 Preview Shows Off Siren's Deadly Abilities and Summons
12-07-2025 07:22
As the launch date for Borderlands 4 draws ever closer, Gearbox has started to reveal more information about the gameplay that we will see in the new looter shooter. The latest reveal comes by way of a short YouTube video showcasing the abilities and gameplay of the new siren, Vex. All of the abilities the new siren demonstrates are somehow related to the concept of death, and they add to the whole necromancer motif Gearbox has dreamt up for her. Overall, Vex's abilities seem to strike a balance between crowd control and 1v1 combat, and they seem to offer a decent amount of build versatility. Aside from showing off Vex's skills, the preview also gives us a glimpse at some of the enemy diversity that we can expect from Borderlands 4, and it certainly looks like there will be no shortage of different enemy types, from the typical ground-based foot soldiers to bullet-hell inspired bosses and flying minions that will harass you while you battle bigger enemies. Incarnate gives Vex a pair of wings, increasing her movement speed and granting her the ability to cast energy projectiles at enemies, steal health, and buff her stats for improved survivability. Critically, the energy projectiles come from her off hand, meaning she can still use her weapon while the ability is active. Dead Ringer, summons a host of ephemeral clones of Vex, which automatically target and damage nearby enemies—this will likely come in handy when surrounded or facing off against a boss that needs your full attention. This ability has two versions—one that summons a single scythe-wielding clone that hunts enemies down with powerful melee attacks and can taunt thm as well, and one that summons multiple stationary clones that attack with ranged weapons. Phase Phamiliar allows players to summon a cat-like companion named Trouble that will seek out and attack enemies similar to FL4K's companion-based action skills from Borderlands 3. Trouble can blink to enemies and has increased critical hit chance. Vex can apparently also trigger the companion to explode on command for AOE damage. Some of these augmentations and ability variations will no doubt be locked behind skill points or even character-specific class mods. Read full story Colorful Debuts iGame Duo SSD: GPU with Two M.2 Drives
11-07-2025 18:39
At Bilibili World 2025, Colorful quietly introduced a unique all-white version of its iGame Ultra Duo SSD graphics card that combines high-end GPU performance with built-in storage. The card features a two‑fan cooler coated in matte white, which immediately sets it apart from the usual dark designs you see on the market. Although Colorful has not confirmed whether it is based on NVIDIA's new GB206 or GB207 architecture, either RTX 5050 or 5060, the real point of this product is the dual M.2 SSD slots on the back of the compact PCB. Users can simply slide in drives without any extra cables, and the heatsink mounting points are cleverly positioned between the storage bays and the rear I/O bracket. Thanks to PCIe bifurcation, the card splits a standard x16 slot into eight lanes for the GPU and four lanes for each SSD, so neither graphics nor storage performance is compromised. Given that the PCIe bandwidth is more than enough for this GPU SKU, even an x8 lane is enough for performance to stay intact. By placing SSDs near active cooling, Colorful ensures they stay cool even under heavy workloads. Official specs and pricing are not yet available, but this hybrid design is sure to catch the eye of gamers and content creators looking for a sleek, high-capacity storage build. Intel "Nova Lake-S" Tapes Out on TSMC N2 Node
11-07-2025 18:09
Intel's next-generation client CPU staple product, "Nova Lake-S", has reportedly taped out of TSMC's fabs in Taiwan. Our previous speculation from the rumor mill suggested that Intel would utilize its own internal 18A node, with help from TSMC's 2 nm high-volume manufacturing. According to SemiAccurate, Intel has taped out a compute tile on TSMC's N2 node, meaning that Nova Lake-S will likely utilize a mix of 18A and TSMC N2 for its compute tiles. A possible reason for this decision is that Intel is building a chain of fall-backs to rely on in case its 18A node doesn't deliver, or it anticipates demand so high that its internal manufacturing capacity can't provide. Either way, clients can expect the product to be delivered on time in H2 of 2026, but under the hood, some interesting solutions may be present. As far as the exact date, the time from a tapeout to final product is months away. Right now, the taped-out silicon tile is being powered on in Intel's labs and tested, running various test cases that stress out the silicon for multiple use cases and check for correctness of operation. Typically, power on takes a few weeks to a month to achieve, and final high-volume manufacturing will commence only a few months later. From that point, another two to three months are needed for manufacturing and shipping the product, meaning that Q3 of 2026 is the most likely target for Nova Lake-S. As a reminder, the CPU will combine 52 cores (16 P-cores, 32 E-cores, and four LPE-cores) paired with 8,800 MT/s memory controller and Xe3 "Celestial" for graphics rendering and Xe4 "Druid" for media and display duties, making it definitely an interesting product, as well as a difficult manufacturing target due to the heterogenous complexity. (PR) QNAP Launches the 16-channel PoE+ Network Smart NVR TVR-AI200
11-07-2025 13:54
QNAP Systems, Inc., a leading computing, networking, and storage solutions innovator, has released the new 16-channel PoE+ Network Smart NVR TVR-AI200. It supports real-time video/audio surveillance, high-quality recording, and can be installed on a desktop or in a rack. With PoE+ networking and plug-and-play features, the TVR-AI200 not only simplifies camera cabling and installation, but also allows users to complete offline setup and start recording within 10 minutes. The TVR-AI200 combines the security of an isolated network with flexible management capabilities for optional WAN connectivity. Coupled with AI video analytics and centralized management capabilities, it provides a highly efficient, reliable, and cost-effective surveillance solution for smart retail and commercial environments. Key Features of the TVR-AI200Plug-and-Play Camera Setup:Compliant with the 802.3at PoE+ standard, and supplies sixteen ports of 25.5-watt PoE power to IP cameras, simplifying deployment.Isolated Network Design:Creates an isolated network for offline operation to enhance surveillance security and privacy, and reduce cybersecurity risks. Read full story (PR) D-Link Unveils New DMS-1250 Series Smart Switches
11-07-2025 12:38
D-Link Corporation, a global leader in networking solutions, is delighted to announce the launch of its latest DMS-1250 Series, 2.5G layer 2 standard smart switches that include 4 copper switches (DMS-1250-10S/ DMS-1250-12/ DMS-1250-18/ DMS-1250-28) and 4 PoE switches (DMS-1250-10SP/ DMS-1250-12TP/ DMS-1250-18P/ DMS-1250-28P). It is designed to meet the increasing demands of modern networks, offering 2.5G downlink ports for high-speed device connectivity and 10G/10G SFP+ uplink ports to ensure fast, reliable backbone performance. Built-in IEEE 802.3af/at/bt PoE support, the switches deliver up to 60 W per port, providing reliable power for high-demand devices such as Wi-Fi access points, IP cameras, and VoIP phones. All 2.5G ports feature 6kV surge protection, ensuring robust durability and safeguarding connected devices against power surges. Flexible Port Options and Versatile Connectivity for Any Network The DMS-1250 Series offers versatile port configurations from compact 10-port models to high-capacity 28-port options providing flexibility to scale networks to meet diverse infrastructure requirements. Supporting copper, fiber, and advanced Power over Ethernet (PoE) standards, including IEEE 802.3af/at/bt, these switches can power a wide range of PoE-enabled devices over standard Ethernet cables, eliminating the need for separate electrical wiring. Whether deployed in small offices, enterprise edge networks, or high-density smart campuses, the DMS-1250 Series ensures reliable, scalable, and high-performance connectivity. With flexible hardware, comprehensive Layer 2 features, and centralized management via Nuclias Connect, it is a future-ready solution designed to meet evolving network demands. Read full story AMD Radeon RX 9070 GRE Tested, Fills Gap Between RX 9060 XT and RX 9070
11-07-2025 10:44
AMD released the China-exclusive Radeon RX 9070 GRE in May, and ComputerBase.de caught hold of a Sapphire Pulse branded RX 9070 GRE card to test. While the RX 9060 XT specs sheet reads as being exactly half of the RX 9070 XT, the RX 9070 GRE is configured to be three quarters of it. It's based on the same 4 nm "Navi 48" silicon as the rest of the RX 9070 series, but is configured with 48 compute units out of the 64 present, and comes with 12 GB of memory across a 192-bit wide GDDR6 memory bus, in place of the 256-bit wide one that the RX 9070 and RX 9070 XT come with. With 48 CU, the RX 9070 GRE has 3,072 stream processors, 96 AI accelerators, 48 RT accelerators, 192 TMUs, and 96 ROPs. The Infinity Cache size is reduced to 48 MB. The card comes with the same 220 W TBP as the RX 9070. Testing by ComputerBase.de finds that despite its reduction in compute units and memory, the RX 9070 GRE is still a 1440p-class GPU, and a significant upgrade over the RX 9060 XT 16 GB and the NVIDIA GeForce RTX 5060 Ti 16 GB. Averaged across 13 game tests, at 1440p, the RX 9070 GRE tests 28.4% faster than RX 9060 XT 16 GB, 22% faster than RTX 5060 Ti 16 GB, and 11% faster than the previous-gen RX 7800 XT, and 5% faster than RTX 4070. The current-gen RTX 5070 is 9% faster, RX 9070 is 14% faster, and the current flagship RX 9070 XT is 29% faster. This makes the RX 9070 GRE an interesting SKU that's at the intersection of various price-performance combinations within the 1440p class. In the Chinese domestic market, the RX 9070 GRE is priced slightly higher than the RTX 5060 Ti 16 GB, but lower than the RTX 5070, making it a good value proposition. Find more test results and insights in the source link below. SUDOKOO Launches Exclusive Prime Week Deals on Award-Winning PC Coolers
11-07-2025 10:00
SUDOKOO, the premium PC cooling brand acclaimed for engineering precision and innovative design, is excited to unveil limited-time discounts on its flagship CPU coolers in celebration of Amazon Prime Day and Newegg FantasTech Week, running July 8-13, 2025. These exclusive promotions offer gamers, PC builders, and performance enthusiasts a chance to upgrade their cooling systems with cutting-edge hardware—at unbeatable value. Featured Deals Include:SK700 / SK700V Series—15% OFFHigh-performance AM5-ready air coolers supporting up to 220 W TDPSK700V features 7 heatpipes, an offset single-tower for full RAM clearance, and tool-free L-Rail fan mountingPROTEUS360—15% OFF360 mm AIO liquid cooler supporting up to 320 W TDPMagnetic metal pump cap, 360° tube swivel, and a 3.4" customizable LCD screenNEXAURA Series—20% OFF360 mm ARGB AIO cooler with diamond-cut pump capSupports high-core CPUs up to 300 W TDP with ultra-quiet operation and stunning visual effectsMach FansProteus 360 AIO CPU Cooler Read full story (PR) Team Group Unveils P250Q Self-Destruct Internal NVMe SSD
11-07-2025 09:17
Global memory leader Team Group Inc. today officially unveiled its latest breakthrough in industrial storage: the Team Group Industrial P250Q Self-Destruct SSD. This innovative solution integrates both software and hardware-based data erasure mechanisms, paired with an independent destruction circuit. Engineered to meet the stringent security and stability requirements of military, industrial automation, and AI applications, the P250Q sets a new benchmark for data protection and was recently honored with the 2025 COMPUTEX Best Choice Award for Cybersecurity Category. The P250Q is equipped with a patented independent destruction circuit that enables precise data erasure at the hardware level by directly targeting the Flash IC. It is further supported by an intelligent software system with an auto-resume function that ensures data destruction continues seamlessly after an unexpected power outage, guaranteeing the complete elimination of sensitive information. Designed with real-world deployment in mind, the P250Q combines dual-mode software-hardware destruction, a one-click activation button, and multi-stage LED indicators that display real-time progress, offering intuitive yet robust data protection for high-security environments. Read full story AMD Sampling Next-Gen Ryzen Desktop "Medusa Ridge," Sees Incremental IPC Upgrade, New cIOD
10-07-2025 22:28
AMD is reportedly sampling its next-generation Ryzen desktop processor powered by the "Zen 6" microarchitecture, codenamed "Medusa Ridge," to close industry partners, such as platform designers and OEMs, says Yuri Bubliy, aka 1usmus, author of the Hydra tuning software, and the now-retired DRAM Calculator for Ryzen. The processor sees AMD update both the CCDs and client I/O die, he says. AMD confirmed that it is building the "Zen 6" CCD on the TSMC N2 (2 nm) node, which entered risk production earlier this year. The node is expected to be ready for mass-production of 2 nm chips later this year. The 2 nm node presents a significant jump in transistor densities from the current TSMC N4P node on which AMD builds its 8-core "Zen 5" CCD, which 1usmus and other sources say, that AMD will use to increase CPU core counts per CCD. Sources point to the possibility of AMD increasing core counts per CCD to 12, and giving the CCD 48 MB of L3 cache. At this point we don't know if all 12 cores will be arranged in a single CCX with a monolithic slab of 48 MB L3 cache, or if there's a dual-CCX layout with 6 cores per CCX sharing 24 MB of L3 cache, each. The other big upgrade with "Medusa Ridge" is its client I/O die (cIOD). AMD is expected to build its new generation cIOD on a newer EUV node such as 5 nm N5 or 4 nm N4P, a significant upgrade from the current 6 nm N6. 1usmus says that the biggest reason for AMD to update its cIOD is the memory controller architecture. AMD is expected to give "Medusa Point" a new dual memory controller architecture. There are still two DDR5 channels per socket, but this is redesigned for increased memory speeds, letting AMD catch up with Intel in this area. As for the CPU frequency boosting technologies, such as PBO and Curve Optimizer, there are no updates expected, and 1usmus concludes that it Hydra support should be straightforward.
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